This introduces a lot of complexities, such as uneven heat distribution, contamination, and lower throughput, while performing flux-less reflow of solder in advanced packaging applications. Traditional solder reflow ovens have a horizontal configuration with in-line wafer transfer in the horizontal direction. Reflow soldering is a process in which a solder paste is used to attach one physical component to another physical component in an electronic circuit, after which the entire assembly is subjected to controlled heat to make a permanent bond between the components. 10,490,431 (“Combination vacuum and over-pressure process chamber and methods related thereto”), US 2019/0314738 (“Trap assembly and system for trapping polymer vapors in process oven vacuum systems”), and US 2020/0013591 (“Plasma spreading apparatus and system, and method for spreading plasma in process oven”). 10,147,617 (“Method for the rapid processing of polymer layers in support of imidization process and fan out wafer level packaging including efficient drying of precursor layers”), U.S. 6,198,075 (“Rapid heating and cooling vacuum oven”), U.S. 4,597,736 (“Method and apparatus for heating semiconductor wafers”), U.S. Some of the tools and processes have been disclosed in previously filed patents/published patent applications, e.g., U.S. Semiconductor wafer packaging involves many complicated tools and procedures. The present disclosure relates to heterogeneous integration, assembly, and packaging of integrated circuits in general, and flux-less solder reflow process and tools in particular, especially in vertical batch processing of wafers.
25, 2020, the entireties of which are incorporated herein by reference.